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SHINKAWA
UTC-300BI
1999
Bonding type: Ultrasonic thermocompression bonding type Machine accuracy:±4μm Bonding wire length: Max 7mm Bonding area: X40*Y50 Wire diameter:φ20~38μm

SHINKAWA
UTC-300BI
1998
Bonding method: Ultrasonic thermocompression bonding method Accuracy:±4μm Bonding wire length: Max 7mm Bonding aria:X40Y50 Wire diameter:φ20~38μm