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Ultrasound Machine

[MFR]KAIJO

[Model]MA-6280

[Year]1980

Frequency:19.5KHz Output:500W

SELLER :Tokyo Engineering Co., Ltd.

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ID:#5537

Die Bonder

[MFR]NEC

[Model]CPS-1800R

[Year]2004

SELLER :Tokyo Engineering Co., Ltd.

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Tel

ID:#5538

BC type Lens Processing Machine

[MFR]SAIDA

[Model]

[Year]1974

SELLER :Tokyo Engineering Co., Ltd.

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Tel

ID:#5539

Wire Bonder

[MFR]SHINKAWA

[Model]UTC-300BI

[Year]1999

Bonding type: Ultrasonic thermocompression bonding type Machine accuracy:±4μm Bonding wire length: Max 7mm Bonding area: X40*Y50 Wire diameter:φ20~38μm

SELLER :Tokyo Engineering Co., Ltd.

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Tel

ID:#5540

Wire Bonder

[MFR]SHINKAWA

[Model]UTC-300BI

[Year]1998

Bonding method: Ultrasonic thermocompression bonding method Accuracy:±4μm Bonding wire length: Max 7mm Bonding aria:X40Y50 Wire diameter:φ20~38μm

SELLER :Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5541

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