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Machine Name Wire Bonder

Manufacturer SHINKAWA

Year - 1970 1971 1972 1973 1974 1975 1976 1977 1978 1979 1980 1981 1982 1983 1984 1985 1986 1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021

Country Japan

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1 ～ 5 of 5 POST

Ultrasound Machine

[MFR] KAIJO

[Model] MA-6280

[Year] 1980

Frequency:19.5KHz Output:500W

SELLER : Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5537

Die Bonder

[MFR] NEC

[Model] CPS-1800R

[Year] 2004

SELLER : Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5538

BC type Lens Processing Machine

[MFR] SAIDA

[Model]

[Year] 1974

SELLER : Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5539

Wire Bonder

[MFR] SHINKAWA

[Model] UTC-300BI

[Year] 1999

Bonding type: Ultrasonic thermocompression bonding type Machine accuracy:±4μm Bonding wire length: Max 7mm Bonding area: X40*Y50 Wire diameter:φ20~38μm

SELLER : Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5540

Wire Bonder

[MFR] SHINKAWA

[Model] UTC-300BI

[Year] 1998

Bonding method: Ultrasonic thermocompression bonding method Accuracy:±4μm Bonding wire length: Max 7mm Bonding aria:X40Y50 Wire diameter:φ20~38μm

SELLER : Tokyo Engineering Co., Ltd.

Mail

Tel

ID:#5541