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[MFR] SHINKAWA

[Model] UTC-300BI

[Year] 1999

Bonding type: Ultrasonic thermocompression bonding type Machine accuracy:±4μm Bonding wire length: Max 7mm Bonding area: X40*Y50 Wire diameter:φ20~38μm

[MFR] SHINKAWA

[Model] UTC-300BI

[Year] 1998

Bonding method: Ultrasonic thermocompression bonding method Accuracy:±4μm Bonding wire length: Max 7mm Bonding aria:X40Y50 Wire diameter:φ20~38μm

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